The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2005
Filed:
Oct. 16, 2002
Byoung Kee Kim, Changwon-shi, KR;
Seong Hyeon Hong, Changwon-shi, KR;
Yong Won Woo, Seongnam-shi, KR;
Byoung Kee Kim, Changwon-shi, KR;
Seong Hyeon Hong, Changwon-shi, KR;
Yong Won Woo, Seongnam-shi, KR;
Korea Institute of Machinery and Materials, , KR;
Nanotech Co., Ltd., , KR;
Abstract
The present invention relates to a method of producing W—Cu based composite powder, which is used in heat-sink materials for high-power integrated circuits, electric contact materials, etc, and to a method of producing a W—Cu based sintered alloy by using the composite powder. The method of producing tungsten-copper based composite powder includes first preparing composite oxide powder by dissolving ammonium metatungstate, [(NH)(HWO).4HO], as water-soluble tungsten salt, and copper nitrate or copper acetate in water to the desirable composition, followed by spray-drying and calcining; then preparing a tungsten oxide powder by separately calcining a tungsten-containing salt, such as ammonium paratungstate, (NH)(HWO); forming ultra-fine tungsten-copper based composite oxide powder by mixing 20˜75 wt % of the composite oxide powder and 80˜25 wt % of the tungsten oxide powder to the desirable composition, followed by ball-milling; and reducing the ultra-fine tungsten-copper based composite oxide powder at temperature of 650˜1,050° C. If the composite powder is molded into a certain size and sintered thereafter in temperature of 1,110˜1,450° C., a W—Cu based sintered alloy of superior thermal and electric conductivities can be obtained thereby.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile