The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2005
Filed:
Jun. 18, 2004
Mitsuhiko Ogihara, Hachioji, JP;
Hiroyuki Fujiwara, Hachioji, JP;
Masaaki Sakuta, Tokyo, JP;
Ichimatsu Abiko, Tokyo, JP;
Mitsuhiko Ogihara, Hachioji, JP;
Hiroyuki Fujiwara, Hachioji, JP;
Masaaki Sakuta, Tokyo, JP;
Ichimatsu Abiko, Tokyo, JP;
Oki Data Corporation, Tokyo, JP;
Abstract
A peeling layer () and semiconductor thin film () are formed on a first substrate (), individual support materials () are formed thereupon, grooves () penetrating the semiconductor thin film and reaching the peeling layer () are formed in the semiconductor thin film () by etching using the individual support materials () as a mask so as to divide the semiconductor thin film () into a plurality of semiconductor thin film pieces () and form a plurality of assemblies of the semiconductor thin film pieces () and the individual support materials () fixed thereto, the semiconductor thin film pieces () are separated from the first substrate () while the individual support materials () remain fixed to the semiconductor thin film pieces (), and they are then affixed to a second substrate (). The invention facilitates handling of semiconductor thin film pieces.