The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6913962 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 05, 2005

Filed:

Jul. 15, 2003
Applicant:

Yasuo Okada, Kanagawa, JP;

Inventor:

Yasuo Okada, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/8238 ;
U.S. Cl.
CPC ...
Abstract

A manufacturing method of a semiconductor device disclosed herein, comprises: forming a buried insulating film in a semiconductor substrate; forming semiconductor elements isolated by the buried insulating film; cleaning a surface side of the semiconductor substrate with a cleaning solution; and covering a surface side of the buried insulating film with a protective film before the step of cleaning the surface side of the semiconductor substrate, wherein a protective film is resistant to the cleaning solution.


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Okada, Yasuo. (2005). Manufacturing method of semiconductor device and semiconductor device (U.S. Patent No. 6913962). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6913962

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