The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2005
Filed:
Jan. 14, 2003
Etsuo Yamada, Tokyo, JP;
Kenji Nagasaki, Tokyo, JP;
Yasushi Shiraishi, Tokyo, JP;
Kazuhiko Sera, Tokyo, JP;
Etsuo Yamada, Tokyo, JP;
Kenji Nagasaki, Tokyo, JP;
Yasushi Shiraishi, Tokyo, JP;
Kazuhiko Sera, Tokyo, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Abstract
A semiconductor device which is sealed with a plastic sealing layer and whose thickness is regulated to be below a given value is known. Since the thickness of the device is small, and the thickness of the upper portion of the plastic sealing layer and the thickness of the lower portion thereof are different from each other, the plastic sealing layer becomes warped, thus causing a crack on the side of the semiconductor chip. To solve this problem, the semiconductor device according to the present invention comprises a semiconductor chip on which a plurality of grooves are defined. Consequently, the thickness of the lower portion of the plastic layer becomes greater, thereby preventing cracks from occurring on the semiconductor chip.