The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2005

Filed:

May. 18, 2001
Applicants:

Yasushi Hasegawa, Futtsu, JP;

Yasuhiro Shinohara, Futtsu, JP;

Yutaka Takagi, Hashima, JP;

Inventors:

Yasushi Hasegawa, Futtsu, JP;

Yasuhiro Shinohara, Futtsu, JP;

Yutaka Takagi, Hashima, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B015/04 ; B32B015/18 ; B32B003/10 ; B32B003/20 ;
U.S. Cl.
CPC ...
Abstract

A precision machine part is made of a plurality of pieces with a transient liquid phase diffusion bonding alloy provided between the pieces to bond them together. The precision machine part has one or more conveyance passages formed in it, has a longitudinal axis and is configured to permit passage of liquid or gas through the conveyance passage from a pipe line or cylinder. The pieces of the precision machine part are adhered to each other by transient liquid phase bonding with a ribbon of an amorphous bonding alloy. The bonding alloy can contain 1 to 10 atomic % V or can contain 1 to 15 atomic % of B or P or a mixture of B and P and 1 to 10 atomic % V, the balance being Fe and unavoidable impurities, and can exhibit an amount of contraction in a bonding stress loading direction caused by plastic deformation in the bonding process of not more than 5%. The bonding alloy may be an amorphous Ni-based alloy.


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