The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2005
Filed:
Jun. 30, 2003
Lars-anders Olofsson, Järfälla, SE;
Lars-Anders Olofsson, Järfälla, SE;
Abstract
A method of providing thermal vias in a printed circuit board that includes one or more layers of board material is disclosed. The vias provide for conducting heat from components mounted on the board. One or more holes () are provided in a printed circuit board that may include several metal layers. A metal ball () is inserted into each hole and subjected to pressure such as to deform said ball, and tightly fixating the resultant slug against the wall () of said hole. The deformed ball or slug fixed in the hole, which may have a metallised inner surface, functions to conduct heat and/or electricity between a metallised topside () and bottom side () of the printed circuit board and also between intermediate metallised layers in the case of a multi-layer board.