The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2005
Filed:
Aug. 04, 2004
Kenji Sugaya, Kiryu, JP;
Kensuke Shoji, Kiryu, JP;
Kenji Sugaya, Kiryu, JP;
Kensuke Shoji, Kiryu, JP;
Japan Servo Co., Ltd., Tokyo, JP;
Abstract
A lamination system comprises a thermocompression bonding means for bonding laminate films on top and/or back surfaces of cards, applying heat and pressure using a pair of heat rollers. The lamination system is provided with contact type temperature detection devices for detecting surface temperatures of the heat rollers and a heat roller attaching/detaching device for attaching or detaching the heat rollers. The heat roller attaching/detaching device places the temperature detection devices in contact with surfaces of the heat rollers when the heat rollers are being installed in the lamination system, and places the temperature detection devices apart from the heat rollers when the heat rollers are to be attached to, or detached from, the lamination system.