The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2005
Filed:
Mar. 15, 2002
Thomas David Kudrle, Cambridge, MA (US);
Carlos Horacio Mastrangelo, Andover, MA (US);
Marc Waelti, East Hamstead, NH (US);
Chuanche Wang, Wilmington, MA (US);
Gordon M. Shedd, Lawrenceville, PA (US);
Gregory A. Kirkos, Somerville, MA (US);
Mirela Gabriela Bancu, Somerville, MA (US);
James Ching-ming Hsiao, Somerville, MA (US);
Thomas David Kudrle, Cambridge, MA (US);
Carlos Horacio Mastrangelo, Andover, MA (US);
Marc Waelti, East Hamstead, NH (US);
ChuanChe Wang, Wilmington, MA (US);
Gordon M. Shedd, Lawrenceville, PA (US);
Gregory A. Kirkos, Somerville, MA (US);
Mirela Gabriela Bancu, Somerville, MA (US);
James Ching-Ming Hsiao, Somerville, MA (US);
Corning Incorporated, Corning, NY (US);
Abstract
One embodiment is directed to a gimbal mechanism for a MEMS mirror device having folded flexure hinges. Another embodiment is directed to a gimbal mechanism having a frame with through-holes or recesses distributed thereabout to reduce weight of said frame. Other embodiments are directed to improved electrode structures for electrostatically actuated MEMS devices. Other embodiments are directed to methods for fabricating electrodes for electrostatically actuated MEMS devices. Other embodiments are directed to methods of fabricating through-wafer interconnect devices. Other embodiments are directed to MEMS mirror array packaging. Other embodiments are directed to electrostatically actuated MEMS devices having driver circuits integrated therewith. Other embodiments are directed to methods of patterning wafers with a plurality of through-holes. Other embodiments are directed to methods of forming moveable structures in MEMS devices. Other embodiments are directed to methods of depositing a thin film on the back of a MEMS device.