The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2005

Filed:

May. 05, 2003
Applicants:

Matthew Chraft, Atwater, CA (US);

Roy J. Henson, Pleasanton, CA (US);

Charles A. Miller, Fremont, CA (US);

Chih-chiang Tseng, Dublin, CA (US);

Inventors:

Matthew Chraft, Atwater, CA (US);

Roy J. Henson, Pleasanton, CA (US);

Charles A. Miller, Fremont, CA (US);

Chih-Chiang Tseng, Dublin, CA (US);

Assignee:

FormFactor, Inc., Livermore, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R031/02 ;
U.S. Cl.
CPC ...
Abstract

A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC's pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC's pads. A flex strip may alternatively be disposed behind a substrate with probes.


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