The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2005
Filed:
Sep. 13, 2002
Akihiro Motoki, Fukui, JP;
Shoichi Higuchi, Shiga-ken, JP;
Yoshihiko Takano, Sabae, JP;
Kunihiko Hamada, Kyoto, JP;
Akihiro Motoki, Fukui, JP;
Shoichi Higuchi, Shiga-ken, JP;
Yoshihiko Takano, Sabae, JP;
Kunihiko Hamada, Kyoto, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group consisting of citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these acids, and gluconic lactone; and a brightener including at least one surfactant having an HLB value of about 10 or more. The tin plating adhesion of the resulting ceramic chip electronic components can be limited to a certain level.