The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2005
Filed:
May. 16, 2002
Sue-ryeon Kim, Suwon, KR;
Seung-un Kim, Suwon, KR;
Seung-ki Chae, Seoul, KR;
Je-gu Lee, Hwsaung, KR;
Seung-hoon Ahn, Yongin, KR;
Sue-Ryeon Kim, Suwon, KR;
Seung-Un Kim, Suwon, KR;
Seung-Ki Chae, Seoul, KR;
Je-Gu Lee, Hwsaung, KR;
Seung-Hoon Ahn, Yongin, KR;
Samsung Electronics Co., Ltd., Kyungki-do, KR;
Abstract
A computer-controlled slurry supplying apparatus for providing abrasive slurry to a chemical mechanical polishing (CMP) machine in a semiconductor manufacturing process preferably comprises a storage portion for accepting and storing a quantity of undiluted slurry, a mixing portion for accepting undiluted slurry from the storage portion and mixing with a diluting solution to created a diluted slurry, a supply portion for holding the diluted slurry, and at least one point-of-use mixing unit for mixing at least one chemical additive to the diluted slurry at or near a dispensing nozzle at the point of application. Each of the above portions of the slurry supplying apparatus further includes a re-circulation means for keep solutions in a mixed and agitated state. A method for using the slurry supplying apparatus comprises steps of controllably operating various valves, pumps, and sensors to maintain a desired slurry composition and flow rate.