The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2005

Filed:

Jul. 15, 2003
Applicants:

Hyung Man Lee, Whaseong-Si, KR;

Young Min Im, Whaseong-Si, KR;

Myung Jin Kim, Sungnam-Si, KR;

Hwe Kyung Kim, Seoul, KR;

Young IL Kim, Suwon-Si, KR;

Inventors:

Hyung Man Lee, Whaseong-Si, KR;

Young Min Im, Whaseong-Si, KR;

Myung Jin Kim, Sungnam-Si, KR;

Hwe Kyung Kim, Seoul, KR;

Young Il Kim, Suwon-Si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B008/32 ;
U.S. Cl.
CPC ...
Abstract

The present invention relates to a method of packaging optical parts for optical communication. According to the method of the present invention, there are advantages in that a packaging process for optical parts is automated to improve productivity and to obtain price competitiveness and uniformity of quality, and a high frequency heater for locally transferring heat to only a solder preform is used to minimize thermal deformation of areas except a soldering area, thereby achieving highly reliable packaging of the optical parts.


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