The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2005

Filed:

Jun. 10, 2002
Applicants:

Osamu Hamamoto, Kanagawa, JP;

Koji Sato, Kanagawa, JP;

Kenji Kajiwara, Kanagawa, JP;

Inventors:

Osamu Hamamoto, Kanagawa, JP;

Koji Sato, Kanagawa, JP;

Kenji Kajiwara, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ; H01L023/52 ;
U.S. Cl.
CPC ...
Abstract

The invention concerns a flexible substrate comprising an inner lead connected to an external connection terminal formed on a substrate, and a base film formed on the lead. The base film area above the substrate and closest to the terminal is thinner than the terminal. The invention also provides a semiconductor device comprising an inner lead connected to an external connection terminal formed on a substrate, and a base film formed on the lead. The base film area above the substrate and closest to the terminal is thinner than the terminal. The invention also provides for a manufacturing method a semiconductor device comprising a substrate, an external connection terminal, and an inner lead with a base film. Further, the invention provides a semiconductor device with a substrate with a chamfered corner between the connection and side faces. By the invention, connection of an inner lead or a flexible substrate is made easier.


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