The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2005

Filed:

Mar. 14, 2003
Applicants:

David Fiedler, New Braunfels, TX (US);

David W. Currier, McHenry, IL (US);

Horace M. Long, Cibolo, TX (US);

James V. Lowery, Kirby, TX (US);

Inventors:

David Fiedler, New Braunfels, TX (US);

David W. Currier, McHenry, IL (US);

Horace M. Long, Cibolo, TX (US);

James V. Lowery, Kirby, TX (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C053/04 ;
U.S. Cl.
CPC ...
Abstract

A method and apparatus for bending a substantially rigid substrate () having first and second portions () interconnected by a bend region (). The apparatus comprises first and second heated die members (). The first heated die member () has a longitudinal body portion () and an outer edge portion () that extends along the longitudinal body portion () and is substantially rounded. The second heated die member () has a longitudinal body portion () and a groove () that extends along the longitudinal body portion (). The first and second heated die members () are configured to contact the substrate () and are capable of bending the substrate () in the bend region () when the outer edge portion () of the first heated die member () slides into the groove () of the second heated die member (). There is also a method for bending the substantially rigid substrate ().


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