The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2005
Filed:
Sep. 04, 2003
Takashi Yamazaki, Mishima, JP;
Haruyuki Matsubayashi, Numazu, JP;
Takeshi Abe, Mishima, JP;
Toshiba Machine Co., LTD, Tokyo, JP;
Abstract
The present invention relates to a method of detecting a malfunction during a die clamping step in an injection molding machine. A reference pattern is taken which shows a relation between a die clamping force and a position of a movable platen when die clamping is normally carried out. One or more monitoring sections are set in advance with respect to that position on the basis of the reference pattern and an allowable limit value of a die clamping force in the respective monitoring sections is also set in advance in a form of a linear function of the position. The die clamping force is monitored in the respective monitoring section during a respective die clamping step and, when its value exceeds the allowable limit value, it is decided that a malfunction occurs and an alarm is issued.