The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2005

Filed:

Oct. 29, 2003
Applicants:

Michinobu Tanioka, Tokyo, JP;

Toshinobu Ogatsu, Tokyo, JP;

Inventors:

Michinobu Tanioka, Tokyo, JP;

Toshinobu Ogatsu, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R031/26 ;
U.S. Cl.
CPC ...
Abstract

Semiconductor device inspection apparatus suitable for inspecting narrow-pitched semiconductor devices and an inspection method. The apparatus has a wafer stage, a base table, an X stage, a Y stage, an elevation unit mounted on the Y stage and elevates the wafer stage up and down, a rotary unit which turns the wafer stage, a vibration elimination table which reduces vibration of the base table, a probe card having plural probe needles which electrically contact plural electrodes when the wafer stage moves upward, and a probe card holder where the probe card is to be placed. The heights of needles of the probe card are detected by a laser displacement meter. Images of a wafer and the needles are sensed by a camera. Based on image information, positions of the wafer and probe card are computed and the X stage, Y stage and elevation unit are controlled.


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