The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2005
Filed:
May. 29, 2003
Eiichi Furukubo, Kadoma, JP;
Masami Hori, Hirakata, JP;
Kazuya Nohara, Katano, JP;
Matsushita Electric Works, Ltd., Osaka, JP;
Abstract
A sensor package P is a surface-mounted sensor package which is adapted to be mounted on a printed board. The sensor package P includes a casefor accommodating a semiconductor acceleration sensor chiphaving output pads. The case has a bottom wall, which is divided into a center areafor supporting the sensor chipand a peripheral area. Output electrodesto be connected to the output padsare formed on external surfaces of the peripheral area. These output electrodesare soldered to the printed boardfor electrical connection between the sensor chip and an electric circuit of the printed board as well as for holding the sensor package physically on the printed board. The feature of the present invention resides in that groovesare formed in an interior surface of the bottom wallbetween the center areaand the peripheral area