The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2005
Filed:
Nov. 04, 2002
John R. Fruth, Kokomo, IN (US);
Scott B. Kesler, Kokomo, IN (US);
John R. Fruth, Kokomo, IN (US);
Scott B. Kesler, Kokomo, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
An integrated circuit () includes a thermal sensing device () and a power-switching device () such as an IGBT. The power device () is fabricated in a conventional manner on a semiconductor substrate, and the thermal sensing device () is fabricated on an electrical insulation layer () formed over the substrate. The thermal sensing device () may be provided in the form of a number of series-connected polysilicon diodes (D-D) positioned adjacent to the power device () such that the operating temperature of the thermal sensing device () is near that of the power device (). In response to an input current I, the thermal sensing device () produces an output voltage (V) that is substantially linear with surface die temperature, and which reacts rapidly to changes in surface die temperature. The thermal sensing device () is completely electrically isolated from the power device, thereby eliminating any electrical interaction therebetween.