The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2005
Filed:
Sep. 22, 2003
Katsuhiko Hayashi, Tokyo 103-8272, JP;
Katsuhiko Hayashi, Tokyo 103-8272, JP;
Other;
Abstract
An object of the present invention is to provide a high frequency module which can efficiently radiate heat generated from a semiconductor chip. A high frequency module according to the present invention employs a substrate, a semiconductor chipfixed on the substrate, a roof platebeing contact with an upper surfaceof the semiconductor chip, and a cap, which is contact with an upper surface of the roof plate, having a flat portionand extended portionsleaded out below from opposite ends of the flat portion. The extended portionsof the capare contact with side surfaces of the substrate. Thus, a wide area contact between the extended portionsof the capand the side surfaces of the substratecan be ensured even if the height of the semiconductor chipfluctuates or the shape of the capfluctuates. This results that heat generated from the semiconductor chipis efficiently radiated to the substrate