The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2005

Filed:

Jul. 16, 2003
Applicants:

Hisayuki Hirai, Yokohama, JP;

Susumu Kojima, Fuchu, JP;

Tamon Ozaki, Tokyo, JP;

Toshio Shimizu, Tokyo, JP;

Takahiro Imai, Tokyo, JP;

Hiroki Sekiya, Kanagawa-Ken, JP;

Isao Onodera, Tokyo, JP;

Inventors:

Hisayuki Hirai, Yokohama, JP;

Susumu Kojima, Fuchu, JP;

Tamon Ozaki, Tokyo, JP;

Toshio Shimizu, Tokyo, JP;

Takahiro Imai, Tokyo, JP;

Hiroki Sekiya, Kanagawa-Ken, JP;

Isao Onodera, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B007/34 ; H01B007/00 ;
U.S. Cl.
CPC ...
Abstract

An enameled wire capable of improving withstand lifetime with respect to the application of surge voltage of an inverter and thermal degradation thereof while restricting an amount of an inorganic filler material is provided. The enameled wire includes an electrically conductive wire () and a coating () formed of a high molecular compound uniformly mixed with an inorganic filler material in the form of fine flat particles provided around the electrically conductive wire (). The enameled wire may include an electrically conductive wire (), a coating () formed of a polyester imide resin solution mixed with an inorganic filler material in the form of fine flat particles and provided on the conductive wire and a coating () formed of polyamide imide and provided on the coating ().


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