The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2005

Filed:

Oct. 23, 2003
Applicants:

Kie Youn Jeong, Suwon-si, KR;

Seung-wook Lee, Daejeon, KR;

Inventors:

Kie Youn Jeong, Suwon-si, KR;

Seung-Wook Lee, Daejeon, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L023/10 ;
U.S. Cl.
CPC ...
Abstract

A polyproplylene-based resin composition for powder slush molding which is a mixture of a polypropylene homopolymer, copolymer, or terpolymer; an olefin rubber; a styrene rubber; a process oil; and a polypropylene wax, wherein the composition is excellent in low-temperature impact resistance and heat resistance and has no offensive odor. The composition can be formed by a cryofreeze pulverization method in the presence of liquid nitrogen into a powder having an average particle size of 200 to 300 μm suitable for powder slush molding. The powder can be adhered to a polyurethane foamed layer and a surface treating agent without a primer coating. The powder is particularly suitable for forming the interior surface for manufacture of an automobile surface such as an instrument panel.


Find Patent Forward Citations

Jeong, Kie. (2005). Polypropylene-based resin composition for powder slush molding (U.S. Patent No. 6906144). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6906144

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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