The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2005
Filed:
Feb. 06, 2003
Applicant:
Hideki Yuzawa, Iida, JP;
Inventor:
Hideki Yuzawa, Iida, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ;
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a semiconductor device includes mounting of a semiconductor chip on a substrate. In the mounting step, electrodes of the semiconductor chip and leads formed on the substrate are disposed to face each other. Each of the electrodes has a bump including a soldering or brazing material in at least part of a bonding section bonded to corresponding one of the leads. After providing an insulating material around the electrodes and leads, the soldering or brazing material is melted, and the electrodes are respectively bonded to the leads.