The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6905909 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 14, 2005

Filed:

Oct. 22, 2003
Applicants:

Hao Cui, West Linn, OR (US);

Peter A. Burke, Portland, OR (US);

Wilbur G. Catabay, Saratoga, CA (US);

Inventors:

Hao Cui, West Linn, OR (US);

Peter A. Burke, Portland, OR (US);

Wilbur G. Catabay, Saratoga, CA (US);

Assignee:

LSI Logic Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/00 ;
U.S. Cl.
CPC ...
Abstract

A method for forming a substantially oxygen-free silicon carbide layer on a substrate, where the silicon carbide layer has a dielectric constant of less than about four. The substrate is held at a deposition temperature of between about zero centigrade and about one hundred centigrade, and a gas flow of tetramethylsilane is introduced at a rate of no more than about one thousand scientific cubic centimeters per minute. The deposition pressure is held between about one milli Torr and about one hundred Torr, and a radio frequency plasma discharge is produced with a power of no more than about two kilowatts. The plasma discharge is halted when a desired thickness of the silicon carbide layer has been formed.


Find Patent Forward Citations

Cui, Hao. (2005). Ultra low dielectric constant thin film (U.S. Patent No. 6905909). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6905909

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