The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2005

Filed:

Jul. 24, 2003
Applicants:

Kwang-shin Lim, Gyeonggi-do, KR;

Pil-kwon Jun, Gyeonggi-do, KR;

Hun-jung Yi, Gyeonggi-do, KR;

Sang-oh Park, Gyeonggi-do, KR;

Yong-kyun Ko, Gyeonggi-do, KR;

Inventors:

Kwang-Shin Lim, Gyeonggi-do, KR;

Pil-Kwon Jun, Gyeonggi-do, KR;

Hun-Jung Yi, Gyeonggi-do, KR;

Sang-Oh Park, Gyeonggi-do, KR;

Yong-Kyun Ko, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B08B007/02 ; H01L021/22 ;
U.S. Cl.
CPC ...
Abstract

An apparatus includes a chamber for containing a fluid, a guide seated in the chamber, and a transfer robot for loading and/or unloading a plurality of wafers to and/or from the guide. The wafers are located on the guide. The guide has a supporting member for supporting a wafer and a stopper member for preventing the wafer from being inclined over a predetermined range. The stopper member is in contact with a wafer edge disposed at a higher position than a wafer edge supported by the supporting member. A wafer guide has a stopper member to prevent adjacent wafers from being inclined and coming in contact with each other. Therefore, it is possible to suppress a poor drying such as water spots (or watermarks) produced when wafers are adhered to each other in a drying process.


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