Method of forming electrical interconnects having electromigration-inhibiting plugs

Abstract

A method is provided for forming an electrical conductors, comprising forming electrically conductive segments incorporating electromigration-inhibiting plugs. A row of windows is formed in a planar surface and electromigration-inhibiting material is deposited over the planar surface and into the windows to provide, electromigration-inhibiting plugs in the windows. The plugs may be formed by depositing an electromigration-inhibiting liner in the windows and then depositing electrically conductive material to fill the windows. Portions of either or both of the plugs and conductive segments are removed such that the plugs and conductive segments have a coplanar surface. The plugs may be formed in windows in an electrically conductive layer defining the conductive segments. Alternatively, windows may be formed in a dielectric layer and the conductive segments formed from electrically conductive material deposited in trenches in the dielectric between neighboring windows, the plugs, conductive segments and dielectric surface being coplanar. Embodiments of the method may be employed in manufacture of integrated circuit conductors.