The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2005
Filed:
Mar. 18, 2003
Dai Nakajima, Tokyo, JP;
Taishi Sasaki, Fukuoka, JP;
Toru Kimura, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A small-sized, light-weight, low-cost power semiconductor device with excellent productivity and vibration resistance is obtained. A mold resin casing () is made of a thermosetting resin, such as epoxy resin, and has a top surface (T) and a bottom surface (B). A through hole () is formed in a non-peripheral portion (in this example, approximately in the center) of the mold resin casing () to pass through between the top surface (T) and the bottom surface (B). Electrodes (N,P,) have their first ends projected from sides of the mold resin casing (). The bottom surface (B) of a heat spreader () is exposed in the bottom surface (B) of the mold resin casing (). The heat spreader () has an opening () formed around the through hole ().