The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2005
Filed:
Dec. 30, 2003
Young Ho Sohn, Seoul, KR;
Young Ho Sohn, Seoul, KR;
Dongbu Electronics Co., Ltd., Seoul, KR;
Abstract
Side braze packages for semiconductor devices are disclosed. A disclosed side braze package includes a lead located at a sidewall of a main body having a groove. A first semiconductor chip is flip chip bonded on the groove through a solder bump. A second semiconductor chip is stacked on the first semiconductor chip. A first through hole is formed from an upper portion of the main body to a lower portion of the main body around an inner sidewall of the groove. A first line is connected to the lead through the solder bump and the first through hole. A second line is connected to the lead through the first through hole. A wire interconnects a pad of the second semiconductor to the second line.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile