The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2005
Filed:
Aug. 25, 2000
Yih-feng Chyan, Jersey City, NJ (US);
John Michael Hergenrother, Short Hills, NJ (US);
Donald Paul Monroe, Berkeley Heights, NJ (US);
Yih-Feng Chyan, Jersey City, NJ (US);
John Michael Hergenrother, Short Hills, NJ (US);
Donald Paul Monroe, Berkeley Heights, NJ (US);
Agere Systems Inc., Allentown, PA (US);
Abstract
An architecture for connection between regions in or adjacent a semiconductor layer. According to one embodiment a semiconductor device includes a first layer of semiconductor material and a first field effect transistor having a first source/drain region formed in the first layer. A channel region of the transistor is formed over the first layer and an associated second source/drain region is formed over the channel region. The device includes a second field effect transistor also having a first source/drain region formed in the first layer. A channel region of the second transistor is formed over the first layer and an associated second source/drain region is formed over the channel region. A conductive layer comprising a metal is positioned between the first source/drain region of each transistor to conduct current from one first source/drain region to the other first source/drain region. In another embodiment a first device region, is formed on a semiconductor layer. A second device region, is also formed on the semiconductor layer. A conductor layer comprising metal is positioned adjacent the first and second device regions to effect electrical connection between the first and second device regions. A first field effect transistor gate region is formed over the first device region and the conductor layer and a second field effect transistor gate region is formed over the second device region and the conductor layer.