The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2005

Filed:

Oct. 02, 2002
Applicants:

Eric Spencer Hall, Lexington, KY (US);

Shauna Marie Leis, Georgetown, KY (US);

Andrew Lee Mcnees, Lexington, KY (US);

James Michael Mrvos, Lexington, KY (US);

James Harold Powers, Lexington, KY (US);

Carl Edmond Sullivan, Stamping Ground, KY (US);

Inventors:

Eric Spencer Hall, Lexington, KY (US);

Shauna Marie Leis, Georgetown, KY (US);

Andrew Lee McNees, Lexington, KY (US);

James Michael Mrvos, Lexington, KY (US);

James Harold Powers, Lexington, KY (US);

Carl Edmond Sullivan, Stamping Ground, KY (US);

Assignee:

Lexmark International, Inc., Lexington, KY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J002/05 ;
U.S. Cl.
CPC ...
Abstract

The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying a first photoresist material to a first surface side of the chip. The first photoresist material is patterned and developed to define at least one ink via location therein. An etch stop material is applied to a second surface side of the chip. At least one ink via is anisotropically etched with a dry etch process through the thickness of the silicon chip up to the etch stop layer from the first surface side of the chip. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.


Find Patent Forward Citations

Loading…