The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
Dec. 21, 2000
Applicants:
Masaki Okayasu, Saitama, JP;
Shinnosuke Fukuda, Saitama, JP;
Hirofumi Tanaka, Saitama, JP;
Inventors:
Assignee:
Pioneer Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S003/04 ; H01S005/00 ;
U.S. Cl.
CPC ...
Abstract
A resin packageis hollowed in order to house components of a hybrid optical module. Laser devicesandare die-bonded to metal framesand, respectively. Ends of the metal frames are bent, and then embedded into the resin packageas in-resin bent portions, and. In a frame led-out portion, portions of the metal framesandare led out to the outside of the resin package. The led-out portionis made in contact with a metal plate, an aluminum die cast member, or the like which is outside the package, whereby the heat radiation effect is improved.