The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
Oct. 25, 2002
Chee Seng Foong, Sungai Buloh, MY;
Kok Wai Mui, Petaling Jaya, MY;
Kim Heng Tan, Singapore, SG;
Lan Chu Tan, Klang, MY;
Chee Seng Foong, Sungai Buloh, MY;
Kok Wai Mui, Petaling Jaya, MY;
Kim Heng Tan, Singapore, SG;
Lan Chu Tan, Klang, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
An image sensor device is made using an ultra-thin substrate so that the overall device height is less than 1.0 mm. The image sensor includes a flexible circuit substrate having first and second opposing sides, the first side having a central area and an outer, bonding pad area including bonding pads. A sensor integrated circuit (IC) is attached to the central area of the first side of the circuit substrate. The IC has an active area and a peripheral bonding pad area including bonding pads. Wires are wirebonded to respective ones of the IC bonding pads and corresponding ones of the circuit substrate bonding pads to electrically connect the IC and the circuit substrate. A wall having a first end with a step and a second end has its second end attached to an outer portion beyond the outer bonding pad area of the first side of the flexible circuit substrate. The wall at least partially surrounds the sensor integrated circuit. A transparent cover is located above the IC such that light can pass through the cover onto the IC active area. Opposing edges of the cover are secured within the step of the wall. Solder balls are attached to the second side of the circuit substrate. The circuit substrate provides for electrical interconnect between the solder balls and the bonding pads on the first side of the circuit substrate.