The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
Sep. 20, 2000
Applicants:
Joseph S. Cachina, Warwick, RI (US);
James R. Zanolli, North Smithfield, RI (US);
Inventors:
Joseph S. Cachina, Warwick, RI (US);
James R. Zanolli, North Smithfield, RI (US);
Assignee:
Teka Interconnections Systems, Inc., Warwick, RI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K001/16 ;
U.S. Cl.
CPC ...
Abstract
A solder bearing—bearing wafer () is provided which is used to connect a first electronic device to a second electronic device. The wafer includes a substrate body having a first surface and second surface, opposing the first surface. The first surface has grooves () formed therein and includes length of solder () dispersed within groove. Upon heating the solder and placement of the wafer between the first and second devices, the two devices are connected.