The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
Apr. 11, 2003
Kuen-yuan Hwang, Hsinchu, TW;
An-pang Tu, Hsinchu, TW;
Mong Liang, Hsinchu, TW;
Chi-yi Ju, Hsinchu, TW;
Sheng-yen Wu, Hsinchu, TW;
Chun-hsiung Kao, Hsinchu, TW;
Fang-shian Su, Hsinchu, TW;
Kuen-Yuan Hwang, Hsinchu, TW;
An-Pang Tu, Hsinchu, TW;
Mong Liang, Hsinchu, TW;
Chi-Yi Ju, Hsinchu, TW;
Sheng-Yen Wu, Hsinchu, TW;
Chun-Hsiung Kao, Hsinchu, TW;
Fang-Shian Su, Hsinchu, TW;
Chang Chun Plastics Co., Ltd., Taipei, TW;
Abstract
Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I):wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.