The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
Apr. 30, 2003
Applicant:
Makiko Nakamura, Tokyo, JP;
Inventor:
Makiko Nakamura, Tokyo, JP;
Assignee:
Oki Electric Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/425 ; H01L021/22 ; H01L021/4763 ; H01L021/44 ;
U.S. Cl.
CPC ...
Abstract
The present invention provides a method of manufacturing a semiconductor device, which is capable of reducing variations in the rate of occurrence of failures at individual connecting portions in the semiconductor device. According to the semiconductor device manufacturing method, a Cu-containing TiN layer, which serves as a cap layer (()), is formed using a Cu-containing Ti target. Cu contained in the Cu-containing TiN layer is diffused into an Al—Cu wiring (()) located in a portion electrically connected to an interlayer wiring () by heat treatment.