The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2005
Filed:
Nov. 20, 2002
Kenneth Raymond Carter, San Jose, CA (US);
Mark Whitney Hart, San Jose, CA (US);
Craig Jon Hawker, Los Gatos, CA (US);
John Campbell Scott, Los Gatos, CA (US);
Kenneth Raymond Carter, San Jose, CA (US);
Mark Whitney Hart, San Jose, CA (US);
Craig Jon Hawker, Los Gatos, CA (US);
John Campbell Scott, Los Gatos, CA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
High density circuitry and metallic patterns are grown from polymer that has been patterned using a contact molding process. The patterned polymer is either intrinsically seedable or treated to make it seedable, e.g., it may be seeded with metallic seed ions, such as Pd ions. The patterned polymer is placed in an electroless deposition bath, with metal being plated onto its surface. Using these methods, metal (e.g, copper) may be deposited onto substrates of either organic or inorganic dielectric materials. The dielectric materials may comprise epoxy resins, ceramics, semiconductors (Si), glass, and silicon oxide.