The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2005
Filed:
Apr. 11, 2003
Lei L. Mercado, Gilbert, AZ (US);
Tien-yu Tom Lee, Phoenix, AZ (US);
Jay Jui Hsiang Liu, Libertyville, IL (US);
Lei L. Mercado, Gilbert, AZ (US);
Tien-Yu Tom Lee, Phoenix, AZ (US);
Jay Jui Hsiang Liu, Libertyville, IL (US);
Motorola Corporation, Schaumburg, IL (US);
Abstract
An electronic component includes an organic interposer (), a semiconductor chip () mounted over the organic interposer, copper pads () under the organic interposer, a solder attachment () between certain ones of the copper pads, and solder interconnects () between certain other ones of the copper pads and located around an outer perimeter () of the solder attachment. The solder attachment is placed at locations within the electronic component that experience the greatest stress, which may include, for example, locations adjacent to at least a portion of a perimeter () of the semiconductor chip. In one embodiment, a surface area of the solder attachment is larger than a surface area of each one of the solder interconnects. In the same or another embodiment, the electronic component includes multiple solder attachments.