The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2005
Filed:
Jul. 08, 2002
Applicants:
Tetsuro Asano, Oizumi-machi, JP;
Masahiro Uekawa, Oizumi-machi, JP;
Koichi Hirata, Ashikaga, JP;
Mikita Sakakibara, Moriguchi, JP;
Inventors:
Tetsuro Asano, Oizumi-machi, JP;
Masahiro Uekawa, Oizumi-machi, JP;
Koichi Hirata, Ashikaga, JP;
Mikita Sakakibara, Moriguchi, JP;
Assignee:
Sanyo Electric, Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/301 ; H01L021/46 ; H01L021/78 ; H01L021/00 ;
U.S. Cl.
CPC ...
Abstract
In a method of manufacturing a compound semiconductor device, individual chip patterns are projected onto a (1 0 0) surface of a GaAs wafer so that the columns and rows of the chip patterns are aligned in a direction slanting by 45 degrees with respect to a [0 1 1] direction of the GaAs wafer. The wafer is diced along this slanting direction and chipping along the edges of the individual separated chips is greatly reduced.