The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2005
Filed:
Dec. 31, 2001
Seong-jae Hong, Chungcheongnam-do, KR;
Joong-hyun Baek, Kyungki-do, KR;
Seong-Jae Hong, Chungcheongnam-do, KR;
Joong-Hyun Baek, Kyungki-do, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
An underfill system for filling gaps between semiconductor chips and substrates is provided. The underfill system comprises a blower for blowing air, an air duct coupled to the blower, the air duct comprising a main duct coupled to the blower and a plurality of sub-ducts each having an outlet being connected to the main duct and an inlet to be located along one side of the semiconductor chip. A filling material from a dispenser fills the gaps by suction due to the pressure difference between the main duct and the sub-duct. Thus, the present invention shortens the filling time of the underfill process and prevents voids or air bubbles of the filling material from forming within the gap.