The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2005

Filed:

May. 30, 2003
Applicants:

Lewis R. Dove, Monument, CO (US);

Robert E. Alman, Santa Rosa, CA (US);

James P. Stephens, Sebastopol, CA (US);

Michael T. Powers, Santa Rosa, CA (US);

Michael B. Whitener, Santa Rosa, CA (US);

Inventors:

Lewis R. Dove, Monument, CO (US);

Robert E. Alman, Santa Rosa, CA (US);

James P. Stephens, Sebastopol, CA (US);

Michael T. Powers, Santa Rosa, CA (US);

Michael B. Whitener, Santa Rosa, CA (US);

Assignee:

Agilent Technologies, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P001/04 ;
U.S. Cl.
CPC ...
Abstract

An interface to a microcircuit formed on a substrate supporting a ground plane. The substrate supports a dielectric structure having gold coated sloped sidewalls electrically connected to the ground plane. A transmission line, connected to the microcircuit, is supported by the dielectric structure. A coaxial cable is connected to the transmission line. The coaxial cable having an end stripped at an angle substantially the same as the sloped side walls of the dielectric structure, wherein the exposed length of the center conductor is bonded to the transmission line, and the outer conductor of the coax cable is bonded to the gold plating on the dielectric structure such that the angled portion of the coax cable mates with the bevel of the thick film dielectric.


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