The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2005
Filed:
Nov. 20, 2003
Matthew Steven Doyle, Rochester, MN (US);
Gregory Roy Edlund, Rochester, MN (US);
Brian Edward Gregg, Rochester, MN (US);
Lynn Robert Landin, Rochester, MN (US);
Thomas W. Liang, Rochester, MN (US);
Matthew Steven Doyle, Rochester, MN (US);
Gregory Roy Edlund, Rochester, MN (US);
Brian Edward Gregg, Rochester, MN (US);
Lynn Robert Landin, Rochester, MN (US);
Thomas W. Liang, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and apparatus are provided for implementing very high density signal probing of a printed circuit board having a pad pattern connected to signals of interest. A metal plate includes a plurality of through holes arranged in a predefined pattern that corresponds to the pad pattern on the printed circuit board. At least one signal module is inserted within a selected one of the through holes of the metal plate. Each signal module defines a coaxial connector for electrical mating engagement with a coaxial cable connector and has an embedded resistor. At least one power/ground module is inserted within a selected one of the through holes. Each power/ground module contains a high dielectric constant material between an outer conductor and a center conductor defining a capacitor. The capacitor provides a low impedance path between the metal plate and a power or ground pad of the printed circuit board.