The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2005
Filed:
Jun. 19, 2001
Shoichi Osada, Gunma-ken, JP;
Toshio Shiobara, Gunma-ken, JP;
Eiichi Asano, Gunma-ken, JP;
Kazutoshi Tomiyoshi, Gunma-ken, JP;
Takayuki Aoki, Gunma-ken, JP;
Shigeki Ino, Gunma-ken, JP;
Shoichi Osada, Gunma-ken, JP;
Toshio Shiobara, Gunma-ken, JP;
Eiichi Asano, Gunma-ken, JP;
Kazutoshi Tomiyoshi, Gunma-ken, JP;
Takayuki Aoki, Gunma-ken, JP;
Shigeki Ino, Gunma-ken, JP;
Shin Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.