The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2005
Filed:
Apr. 17, 2002
Applicant:
Makiko Nakamura, Tokyo, JP;
Inventor:
Makiko Nakamura, Tokyo, JP;
Assignee:
Oki Electric Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/4763 ;
U.S. Cl.
CPC ...
Abstract
A method for manufacturing a semiconductor device capable of forming a fine interconnection structure without making the resistance at the through hole high is provided. More specifically, a semiconductor device having a first interconnection formed on the surface of a first layer insulating film is provided, and a second interconnection is also provided on the upper part of the first interconnection and is electrically connected to the first interconnection, and wherein the first interconnection is formed so that the width of the lower part is narrower than that of the upper part.