The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2005
Filed:
Feb. 19, 2001
Takeshi Inaba, Settsu, JP;
Taketo Kato, Settsu, JP;
Shigehito Sagisaka, Settsu, JP;
Takuya Arase, Settsu, JP;
Tetsuo Shimizu, Settsu, JP;
Takeshi Inaba, Settsu, JP;
Taketo Kato, Settsu, JP;
Shigehito Sagisaka, Settsu, JP;
Takuya Arase, Settsu, JP;
Tetsuo Shimizu, Settsu, JP;
Daikin Industries, Ltd., Osaka, JP;
Abstract
The present invention is to provide a laminated resin molding comprising a polyamide-based resin composition as an outer layer and being excellent in interlayer adhesion strength, in particular a laminated resin molding comprising a fluorine-containing resin as an inner layer. The present invention is a laminated resin molding which comprises a layer (A) comprising a polyamide-based resin composition and a layer (B) laminated to said layer (A), said layer (B) comprising a fluorine-containing ethylenic polymer having a carbonyl group, and said polyamide-based resin composition having a functional group, in addition to an amide group, selected from the group consisting of hydroxyl group, carboxyl group, ester group and sulfonamide group in a total amount of 0.05 to 80 equivalent percent relative to the amide group.