The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2005
Filed:
Nov. 16, 2000
Akitaka Nakayama, Kawasaki, JP;
Akio Ikeda, Kawasaki, JP;
Kiyoshi Hyodo, Kawasaki, JP;
Kazuo Uchida, Kawasaki, JP;
Akitaka Nakayama, Kawasaki, JP;
Akio Ikeda, Kawasaki, JP;
Kiyoshi Hyodo, Kawasaki, JP;
Kazuo Uchida, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
This invention is a method of manufacturing a multi-layer printed wiring board including an internal layer circuit forming step, a outer layer circuit forming step, and a solder resist forming step. In the solder resist forming step, the surface of a board subjected to the outer layer circuit forming step is coated with a photosensitive solder resist material, the solder resist material is coated with a photosensitive film; a light shielding mask is formed by irradiating a laser beam on the photosensitive film according to a formed pattern of the solder resist, the solder resist material is exposed by using the light shielding mask, the light shielding mask is removed, and the solder resist material which is not exposed is removed.