The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6892667 B1

PDF
Full Text
Expired
Date of Patent:
May. 17, 2005

Filed:

Nov. 26, 2002
Applicants:

Nobuyuki Suganuma, Nagoya, JP;

Hiroshi Kobayashi, Nagoya, JP;

Suehiro Kamizono, Nagoya, JP;

Tom Wong, Hong Kong, CN;

Inventors:

Nobuyuki Suganuma, Nagoya, JP;

Hiroshi Kobayashi, Nagoya, JP;

Suehiro Kamizono, Nagoya, JP;

Tom Wong, Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C011/00 ;
U.S. Cl.
CPC ...
Abstract

A filament bundle is rewound from a reel, and passes through various sorts of liquid in processing vessels to be used for plating. The filament bundle passes through a fixed guide roller and a movable guide roller while it travels within the liquid in the processing vessel. The movable guide roller is moved periodically, the filament bundle is stretched and slackened by turns, whenever the filament bundle is slackened or untied, the bundle is loosened. The filament bundle with each filament subjected to the plating is taken up to a take-up reel.


Find Patent Forward Citations

Suganuma, Nobuyuki. (2005). Continuous plating method of filament bundle and apparatus therefor (U.S. Patent No. 6892667). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6892667

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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