The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2005
Filed:
Jun. 15, 2001
Koichi Hiramatsu, Toyota, JP;
Yoshiaki Kadoma, Okazaki, JP;
Kyoichi Mano, Ciryu, JP;
Tsutomu Haeno, Kisarazu, JP;
Hiroo Ishibashi, Kisarazu, JP;
Kazuyuki Kawano, Nagoya, JP;
Osamu Honda, Tokai, JP;
Itsuro Hiroshige, Handa, JP;
Kouichi Sato, Tokai, JP;
Koichi Hiramatsu, Toyota, JP;
Yoshiaki Kadoma, Okazaki, JP;
Kyoichi Mano, Ciryu, JP;
Tsutomu Haeno, Kisarazu, JP;
Hiroo Ishibashi, Kisarazu, JP;
Kazuyuki Kawano, Nagoya, JP;
Osamu Honda, Tokai, JP;
Itsuro Hiroshige, Handa, JP;
Kouichi Sato, Tokai, JP;
Toyota Jidosha Kabushiki Kaisha, Tokyo, JP;
Nippon Steel Corporation, Tokyo, JP;
Abstract
A mold clamping apparatus includes a frame including a holding portion for holding a mold and an open portion allowing the mold to be inserted into/taken out from the holding portion in a direction of the longer side of the mold, a mold moving device for moving the mold to insert/take out the mold into/from the holding portion through the open portion in the frame, and a mold opening/closing device for opening/closing the mold located outside the frame. This mold clamping apparatus is capable of holding the mold securely in a closed state resisting a pressure acting to open the mold and allows reduction of energy consumption, equipment maintenance cost, production cost, and the size thereof.