The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2005
Filed:
Apr. 26, 2001
Yasuo Fukuda, Tokyo, JP;
Masakatsu Nagata, Tokyo, JP;
Shoji Iwasaki, Kamagaya, JP;
Osamu Nakao, Chiba, JP;
Yasuo Fukuda, Tokyo, JP;
Masakatsu Nagata, Tokyo, JP;
Shoji Iwasaki, Kamagaya, JP;
Osamu Nakao, Chiba, JP;
DDK Ltd., Tokyo, JP;
Abstract
A Dry-Film resist formed of, for example, a photosensitive film is stacked on the electroconductive material and these portions, other than a projection electrode formation area, formed on a wiring board's electrode serving as a portion of a circuit pattern are masked with a mask. After this, the wiring board is exposed to light and, after the removal of the mask, a development process is performed, thus eliminating the Dry-Film resist on the wiring board at the portion other than the projection electrode formation area. Then the electroconductive material of the wiring board is etched under an etching process to provide a projection electrode having a bump with a pointed tapering end in vertical cross-section. Finally, the wiring board is exposed to a Dry-Film resist elimination solution to remove remaining Dry-Film resist from the projection electrode. And a plating process is performed on the electroconductive material to form a plated layer and hence complete the projection electrode.