The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2005
Filed:
Jul. 21, 2003
Ryan Lane, San Diego, CA (US);
Edward Reyes, San Diego, CA (US);
Mark Veatch, San Diego, CA (US);
Tom Gregorich, San Diego, CA (US);
Ryan Lane, San Diego, CA (US);
Edward Reyes, San Diego, CA (US);
Mark Veatch, San Diego, CA (US);
Tom Gregorich, San Diego, CA (US);
Qualcomm Incorporated, San Diego, CA (US);
Abstract
An area array package comprising a die attach area for attaching a die to a substrate, a network of staggered bond fingers, and a network of bond islands for coupling bond wires between the bond islands and die bond pads is provided. A network of package leads, for example, a network of solder balls in a ball grid array, is depopulated to permit greater trace route flexibility and via placement within the substrate. Stacked die and multi-chip packages are also disclosed. A method for accommodating a high pin-count die in an area array package is also included.