The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2005
Filed:
Dec. 20, 2002
Jun Taniguchi, Sakata, JP;
Jun Taniguchi, Sakata, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A sealing process in a manufacturing method for semiconductor devices improves product reliability. A die padwith a semiconductor chipmounted thereon is placed between first and second molding diessuch that the die padis supported above the second molding dieA sealantis then injected between the first and second molding diesto seal the semiconductor chipPart of the die padhas one or more protrusionsprojecting in the direction of the second molding dieInjecting the sealantpresses the protrusionsagainst the second molding dieand seals the semiconductor chip
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile