The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2005

Filed:

Feb. 26, 2003
Applicants:

Richard S. Anderson, Seabrook, NH (US);

James H. Connelly, Weymouth, MA (US);

David S. Hanson, West Newbury, MA (US);

Joseph W. Soucy, Winchester, MA (US);

Thomas F. Marinis, Haverhill, MA (US);

Inventors:

Richard S. Anderson, Seabrook, NH (US);

James H. Connelly, Weymouth, MA (US);

David S. Hanson, West Newbury, MA (US);

Joseph W. Soucy, Winchester, MA (US);

Thomas F. Marinis, Haverhill, MA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L027/14 ;
U.S. Cl.
CPC ...
Abstract

An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.


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